bonding electron
英 [ˈbɒndɪŋ ɪˈlektrɒn]
美 [ˈbɑːndɪŋ ɪˈlektrɑːn]
网络 成键电子
双语例句
- The spatial configurations and bonding effects of Oxides of Nitrogen were explained by using the Valence-shell Electron Repulsion Theory, Hybrid-orbital Theory and Molecular orbital Theory.
用杂化轨道理论和分子轨道理论阐明了氮的氧化物成键类型，给出了分子空间构型及结构数据的解释。 - In this paper, we first presented our formula of heterborane ( contain S, P)'s general structure and number of base bonding electron pairs.
作者通过研究，首次给出了含硫、含磷的杂硼烷的结构通式和骨架成键电子对数的计算公式。 - We're going to release a lot of energy for bonding, it's going to more than make up for the fact that we actually had to spend some energy to promote that electron.
在成键时，会释放大量能量，这比补偿激发电子，的能量要多。 - Theoretical Investigations of Electric Field Effect on the Hydrogen Bonding and Electron Transport in DNA Base Pairs
电场极化对碱基对质子转移和电子传递的影响 - Study on Fluorine Induced Aluminum Bonding Pads Corrosions Using Auger Electron Spectroscopy
利用俄歇电子能谱仪研究Al焊垫表面的F腐蚀 - Making Clear Relationships between Electromagnetic Brake ′ s Torque-Speed Ratio and Its Rotor Dimensions Theoretical Investigations of Electric Field Effect on the Hydrogen Bonding and Electron Transport in DNA Base Pairs
电磁制动器力矩特性斜率与转子参数关系的研究电场极化对碱基对质子转移和电子传递的影响 - Interfacial bonding strength between vacuum fusion sintering coating and base metal is measured by normal pulling, and the distribution of alloying elements along the depth is analyzed by electron probe micro analysis.
采用法向拉伸法测定了真空熔烧涂层与母材的界面结合强度，并用电子探针分析了合金元素沿层深分布情况。 - Fracture surfaces of gold wire used for bonding semiconductor devices are researched by Scanning Electron Microscope ( SEM) and Energy Dispersive Analysis of X-ray ( EDX).
用扫描电镜和X射线能谱仪分析研究了半导体器件键合用金丝的断口。 - And experimental teeth were extracted at 1,2 or 3 weeks after bracket bonding. Scanning electron microscopic ( SEM) technique was chosen to assess plaque accumulation on the gingival enamel surface and area around the bracket base.
托槽粘接后1周、2周和3周拔除测试牙，电镜扫描观察托槽周边区域、托槽龈方区域菌斑附着。 - The experimental investigation of the property of the diffusion bonding joint of titanium alloy ( TC4) and stainless steel ( 1Cr18Ni9Ti) was carried out by using pure nickel as the transition metal. The element distribution in diffusion layer was measured by the electron probe.
采用纯镍作中间过渡金属，对钛合金TC4与不锈钢1Cr18Ni9Ti扩散焊接头的结合性能进行了试验研究，利用电子探针测定了扩散层中元素的分布。 - It has been shown that~ 1J_ ( CH) is principally determined by bonding and anti-bonding LMO of the C-H bond and approximately proportional to the product of electron density at the carbon and hydrogen nucleus.
计算结果表明，~1J（CH）主要由定域于碳原子和氢原子化学键区域的成键与反键LMO所决定，并与LMO在碳原子和氢原子核上的电荷密度乘积成比例。 - This paper presents a generalized technique for the preparation of replica and membranous specimen employed in observing the microstructures of bonding layers of Cobalt-cemented tungsten carbide and steel-cemented titanium carbide with TEM ( Transmission Electron Microscope).
本文对钢结和钨钴硬质合金渗硼层在透射电镜下观察时，所采用的复型样品及薄膜样品的制备进行了探索。 - The experimental HREELS show that the bonding between the adsorbed hydrogen and the surface atoms was determined largely by the surface atomic structure and electron distribution.
实验得到吸附的氢与表面原子的成键情况取决于表面的原子结构及电子分布。 - Research on fibrous adsorbent, which was made of polyacrylonitrile fiber by bonding amidoxime and carboxy groups in order to obtain bifunctional group adsorbent, by means of TEM ( Transmisstion Electron Microscone) and SEM-EDAX ( Energy Dispersive Analysis of X-ray).
本文对纤维吸附剂（聚丙烯腈纤维导入偕胺肟基和羧基的双功能基团纤维吸附剂）藉透射电镜（TEM）和扫描电镜X射线色散能量分析谱（SEMEDAX）进行研究。 - Some parameters characterizing the action strength between the organic disulfide compounds and iron atom cluster, including the bonding strength, reactive strength, and static action strength, were analyzed using frontier electron density, super de-localizability, and net atomic charge as criteria.
以前线电子密度、超离域性指数和原子净电荷等参数作为表征有机二硫化物与金属作用强弱的判据，分析了有机二硫化物与铁原子间键合的强弱及反应性大小。 - Diamond-like carbon ( DLC) films were prepared by DC magnetron sputtering. The morphology and chemical bonding structure of the DLC films were investigated by atomic force microscopy ( AFM) and auger electron spectroscopy ( AES), respectively.
以直流磁控溅射制备了类金刚石薄膜，采用原子力显微镜（AFM）观察薄膜的表面形貌，采用俄歇电子能谱（AES）分析薄膜的化学键和电子结构。 - The paper introduces the structure and ingredient distribution of the bonding zone Ni-stainless steel composite plate in different states by metallograph and scanning electron microscope.
用金相和扫描电子显微镜对不同状态的镍-不锈钢复合板结合区的组织和成分分布进行了研究。 - The micro structure, the modification of interface and chemical bonding mechanism of high yield pulp reinforced polyamide resin composite were analyzed by using scanning electron microscopy and fourier transform infrared Spectroscopy.
用扫描电子显微镜测试竹纤维增强聚酰胺树脂复合材料的微观形态，用红外光谱分析了竹纤维增强聚酰胺树脂复合材料界面改性及其化学键结合机理。 - By population analysis the hydrogen bonding is found between the electron donor O atom and the electron acceptor H atom.
通过电子布居分析，发现在电子给予体O原子和电子接受体H原子间存在氢键。 - The analysis of linear thermal expansion and bonding act of magnetic electron of nickel
镍的线热膨胀分析和磁性电子的键合作用 - Transformation superplastic diffusion bonding ( TSDB) of A3 steels and stainless steels has been studied by mains of vacuum diffusion bonding equipment, electron mechanical universal material testing machine.
通过利用真空扩散焊设备，成功地进行了钢与不锈钢相变超塑扩散连接。 - The technology of rolling compound of Al-Cu under room temperature is investigated and the bonding mechanism is discussed by experiments for different the rate of deformation and the temperature of thermal treatment with the help of the optical microscope, mechanical equipment, scanning electron microscope.
通过不同的压下率和不同的扩散退火温度试验，利用金相显微镜，力学实验机、扫描电镜等仪器，研究在室温条件下铝-铜轧制复合工艺，探讨界面结合机理。 - In the process of bonding, the electron transfers from Ni to Ti3+, as a result, the Ni atoms are charged positively.
成键过程中电子由Ni向Ti~（3+）转移，Ni原子带0.07个正电子电荷。 - An experiment was conducted to study the thermodynamic performances and interfacial bonding properties of wheat straw polypropylene ( PP) composite with dynamic mechanical analysis ( DMA) instrument and scanning electron microscope ( SEM) using wheat straw and recycled PP as main raw materials.
以麦秸、废旧聚丙烯为主要原料，采用动态力学热分析仪（DMA）及扫描电子显微镜（SEM）等现代分析测试手段，研究麦秸/聚丙烯（PP）复合材料热力学性能及界面结合特性。 - Or H2O as ligand. It forms hydrogen bonding network with environment which is believed to play an important role in electron transfer and proton transfer.
它是以OH？或H2O为配体的五配位高自旋态化合物，并与周围环境形成氢键网络，可能在电子传导、质子转移中起到关键作用。 - Cation with larger radius can enhance the covalent component of non-bridging oxygen bonding which is the key point for increasing Raman optical activity as confirmed by electron structure calculation.
电子结构的计算同时表明，半径较大的阳离子可以提升非桥氧键的共价性成分，从而导致更大的拉曼散射截面。